Injection molding system
AssigneeSeiko Epson Corporation
InventorsSeijun HORIE, Kazunobu MARUYAMA, Kai UCHIYAMA, Hiroki TAKANO
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AssigneeSeiko Epson Corporation
InventorsSeijun HORIE, Kazunobu MARUYAMA, Kai UCHIYAMA, Hiroki TAKANO
Estimating the term…
An injection molding system including an injection molding device including an injection molding section that has a fixed section to which a fixed molding die and a movable molding die are attached and fixed and that is configured to mold a molded article by injecting a material containing a metal powder into a cavity, and a first movement section for moving the movable molding die between a molding die closed position and a molding die open position, a cleaning device that performs cleaning of the molded article by blowing air, and a control device, wherein when the movable molding die is not at the molding die closed position, the control device does not cause the cleaning device to blow air, and when the movable molding die is at the molding die closed position, the control device causes the cleaning device to perfom blowing of air.
An injection molding system comprising:
Dependencies are inferred from the claim text.