Novel heat pipe configurations

A printed circuit board (PCB) comprising:

• (a) at least a first heat generating component mounted to the PCB at a first location;
• (b) at least a second heat generating component mounted to the PCB at a second location different than said first location;
• and
• (c) at least one heat pipe comprising a closed pipe comprising:
• (i) a condenser section in thermal communication with cooling fluid located outside of said heat pipe,
• (ii) a first evaporator section comprising a first reservoir containing liquid refrigerant in heat transfer contact with said first heat generating component;
• (iii) a first liquid flow path leading a first portion of liquid refrigerant condensed in said condenser section to said reservoir in said first evaporator section;
• (iii) at least a second evaporator section comprising a second reservoir at a location along said heat pipe different than said first reservoir and containing a second portion of liquid refrigerant in heat transfer contact with said at least said second heat generating component;
• and
• (iv) at least a second liquid flow path leading said second portion of liquid refrigerant condensed in said condenser section to said reservoir in said second evaporator section.

A method of transferring heat comprising use of a heat pipe of the type which has a condenser section in which gaseous refrigerant is condensed to produce liquid refrigerant, said method comprising:

• (a) providing a closed heat pipe comprising:
• (i) a condenser section in heat transfer communication with a heat sink located outside the heat pipe,
• (ii) a first evaporator section in fluid communication with said condenser section and comprising a first reservoir containing liquid refrigerant;
• and
• (iii) at least a second evaporator section in fluid communication with said condenser section and comprising a second reservoir containing liquid refrigerant;
• (iv) at least a first liquid flow path leading from said condenser section to said first reservoir;
• and
• (v) at least a second liquid flow path leading from said condenser section to said second reservoir;
• (b) cooling a first component or device by thermal contact with said liquid refrigerant in said first reservoir to produce refrigerant vapor that travels to said condenser section;
• (c) cooling a second component or device by thermal contact with said liquid refrigerant in said second reservoir to produce refrigerant vapor that travels to said condenser section;
• and
• (d) condensing refrigerant vapor in the condenser section to produce condensed liquid refrigerant and returning via said first liquid flow path a first portion of said condensed liquid refrigerant to said first reservoir and returning via said second liquid flow path a second portion of said condensed liquid refrigerant to said second reservoir.