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US 2025/0089171 A1Published application
Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSeung Min LEE
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.
Claims19
A printed circuit board comprising:
- a first insulating layer;
- a pad disposed on an upper side of the first insulating layer;
- a protrusion disposed on the pad;
- and
- a metal post disposed on the pad and covering the protrusion,
- wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post.
3 more elements
A method of manufacturing a printed circuit board, comprising:
- forming a pad on a first insulating layer;
- forming a protrusion on the pad;
- and
- forming a metal post on the pad to cover the protrusion,
- wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post.
2 more elements
A printed circuit board comprising:
- a first insulating layer;
- a pad disposed on an upper side of the first insulating layer;
- a protrusion disposed on and protruding upwardly from an upper surface of the pad, the protrusion having a width smaller than a width of the pad;
- and
- a metal post disposed on the pad and covering an upper surface and a side surface of the protrusion.
2 more elements
Dependencies are inferred from the claim text.