# US 2025/0085803 A1 · Base plate preform, display module preform and methods for manufacturing base plate preform and display module preform > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0085803 A1 - Document ID: US20250085803A1 - Status: Published application - Kind: A1 - Application number: 18/954,480 - Filed: 2024-11-20 - Published: 2025-03-13 - Earliest claimed: 2023-12-29 - Assignees: Hefei Visionox Technology Co., Ltd.; KunShan Go-Visionox Opto-Electronics Co., Ltd - Applicants: Hefei Visionox Technology Co., Ltd.; KunShan Go-Visionox Opto-Electronics Co., Ltd. - Inventors: Yao LI; Wenzhi FAN; Fei CHEN; Haifeng PENG; Linqing LIU - Web page: https://patentgrep.com/patent/US20250085803A1 ## CPC - G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads} - G06F 3/0412: {Digitisers structurally integrated in a display} - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/38: comprising colour filters or colour changing media [CCM] - H10K 59/40: OLEDs integrated with touch screens - H10K 59/879: {comprising refractive means, e.g. lenses} - H10K 59/8792: {comprising light absorbing layers, e.g. black layers} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract Embodiments of the present application provides a base plate preform, a display module preform and methods for manufacturing them, the base plate preform comprising a functional area and a bonding area, the base plate preform further comprising: a substrate; a metal layer located on a side of the substrate, the metal layer comprising a metal wiring located in the functional area and a bonding pad located in the bonding area; a first organic layer located on a side of the metal layer away from the substrate, the first organic layer covering the metal wiring and at least a sidewall of the bonding pad. ## Claims ### Claim 1 A base plate preform, comprising a functional area and a bonding area, the base plate preform further comprising: a substrate; a metal layer located on a side of the substrate, the metal layer comprising a metal wiring located in the functional area and a bonding pad located in the bonding area; a first organic layer located on a side of the metal layer away from the substrate, the first organic layer covering the metal wiring and at least a sidewall of the bonding pad. ### Claim 2 (depends on 1) The base plate preform of claim 1, wherein the first organic layer covers the metal wiring and the bonding pad. ### Claim 3 (depends on 1) The base plate preform of claim 1, wherein the first organic layer covers the functional area and the bonding area; a thickness of the first organic layer in the functional area is greater than or equal to a thickness of the first organic layer in the bonding area. ### Claim 4 (depends on 1) The base plate preform of claim 1, wherein the metal layer is a touch metal layer comprising a first metal layer, and the first organic layer is provided on a side of the first metal layer away from the substrate; the touch metal layer further comprises a second metal layer located on a side of the first metal layer away from the substrate; the first metal layer or the second metal layer comprising the bonding pad located in the bonding area; the first organic layer is located between the first metal layer and the second metal layer, or the first organic layer is located on a side of the second metal layer away from the substrate. ### Claim 5 (depends on 4) The base plate preform of claim 4, wherein the first metal layer comprises a touch lead located in the bonding area, the touch lead being electrically connected with the bonding pad; the metal layer is an array metal layer, and the first organic layer is a planarization layer. ### Claim 6 (depends on 1) A display module preform, comprising the base plate preform of claim 1. ### Claim 7 (depends on 6) The display module preform of claim 6, further comprising an optical improvement layer located on a side of the first organic layer away from the substrate; the optical improvement layer comprises a second organic layer, an orthographic projection of the second organic layer on the substrate not overlapping with an orthographic projection of the bonding pad on the substrate. ### Claim 8 (depends on 7) The display module preform of claim 7, wherein the second organic layer covers the functional area; the second organic layer comprises an organic adhesive; and the second organic layer is made of a same material as the first organic layer. ### Claim 9 (depends on 7) The display module preform of claim 7, wherein the display module preform further comprises a light-emitting layer comprising a plurality of light-emitting units, and the optical improvement layer comprises at least one of a color filter layer or a microlens layer, the second organic layer being located on a side of the color filter layer away from the substrate, the color filter layer comprising a light shielding layer and color filter portions, orthographic projections of the color filter portions on the substrate at least partially overlapping with orthographic projections of the light-emitting units on the substrate, and the light shielding layer being located between the color filter portions. ### Claim 10 (depends on 7) The display module preform of claim 7, wherein the optical improvement layer comprises a microlens layer comprising a first optical functional layer and a second optical functional layer that are stacked, a refractive index of the first optical functional layer being different from a refractive index of the second optical functional layer, and the second organic layer being located on a side of the microlens layer away from the substrate. ### Claim 11 A display module, comprising a display area and a bonding area, the display module further comprising a base plate comprising a substrate, a metal layer and a third organic layer, the metal layer being provided with a bonding pad in the bonding area, the third organic layer covering the display area, and an orthographic projection of the third organic layer on the substrate not overlapping with an orthographic projection of the bonding pad on the substrate. ### Claim 12 (depends on 11) The display module of claim 11, wherein the base plate is a touch base plate, the metal layer is a touch metal layer comprising a first metal layer, the third organic layer being provided on a side of the first metal layer away from the substrate. ### Claim 13 (depends on 12) The display module of claim 12, the touch metal layer further comprises a second metal layer located on a side of the first metal layer away from the substrate, the first metal layer or the second metal layer comprising the bonding pad located in the bonding area; and the third organic layer is located between the first metal layer and the second metal layer, or the third organic layer is located on a side of the second metal layer away from the substrate. ### Claim 14 (depends on 13) The display module of claim 13, wherein the first metal layer comprises a touch lead located in the bonding area and electrically connected with the bonding pad; the base plate is an array base plate, the metal layer is an array metal layer, and the third organic layer is a planarization layer; the bonding pad comprises at least two metal layers stacked; and the bonding pad comprises a first titanium metal layer, an aluminum metal layer and a second titanium metal layer that are stacked. ### Claim 15 A method for manufacturing a base plate preform, the base plate preform comprising a bonding area and a functional area, the method comprising: providing a substrate; forming a metal layer on a side of the substrate, the metal layer comprising a metal wiring located in the functional area and a bonding pad located in the bonding area; forming a first organic layer on a side of the metal layer away from the substrate, the first organic layer covering the metal wiring and at least a sidewall of the bonding pad. ### Claim 16 (depends on 15) The method of claim 15, wherein the first organic layer is formed on a side of the metal layer away from the substrate, and the first organic layer covers the functional area and the bonding area, the step of forming a first organic layer on a side of the metal layer away from the substrate, the first organic layer covering the functional area and the bonding area comprises: forming the first organic layer with a thickness in the functional area greater than or equal to a thickness in the bonding area. ### Claim 17 (depends on 16) The method of claim 16, wherein forming the first organic layer with a thickness in the functional area greater than or equal to a thickness in the bonding area comprises: providing a mask plate on a side of the first organic layer away from the substrate, the mask comprising a non-light-transmitting area and a semi-light-transmitting area, the non-light-transmitting area being provided corresponding to the functional area, and the semi-light-transmitting area being provided corresponding to the bonding area; illuminating a side of the mask plate away from the first organic layer; developing an area of the semi-light-transmitting area corresponding to the base plate by a developing solution, to make a thickness of the first organic layer located in the functional area is greater than a thickness of the first organic layer located in the bonding area. ### Claim 18 (depends on 15) A method for manufacturing a display module, comprising: providing a base plate preform manufactured by the method of claim 15, the method further comprising forming an optical improvement layer on a side of the first organic layer away from the substrate, the optical improvement layer comprising a second organic layer formed on a side of the first organic layer away from the substrate, and an orthographic projection of the second organic layer on the substrate not overlapping with an orthographic projection of the bonding pad on the substrate; thinning the first organic layer located in the bonding area and the second organic layer, to thin the second organic layer and form a fourth organic layer, and to remove a part of the first organic layer located in the bonding area to form a third organic layer, to make the third organic layer cover the functional area. ### Claim 19 (depends on 18) The method of claim 18, wherein the step of forming the second organic layer on a side of the first organic layer away from the substrate comprises: covering the functional area with the second organic layer; the step of thinning the first organic layer located in the bonding area and the second organic layer comprises: ashing the first organic layer located in the bonding area and the second organic layer.