# US 2025/0084294 A1 · Slurry and polishing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0084294 A1 - Document ID: US20250084294A1 - Status: Published application - Kind: A1 - Application number: 18/960,483 - Filed: 2024-11-26 - Published: 2025-03-13 - Earliest claimed: 2018-07-26 - Assignees: Resonac Corporation - Applicants: Resonac Corporation - Inventors: Satoyuki NOMURA; Tomohiro IWANO; Takaaki MATSUMOTO; Tomoyasu HASEGAWA; Tomomi KUKITA - Web page: https://patentgrep.com/patent/US20250084294A1 ## CPC - C09K 3/1454: {Abrasive powders, suspensions and pastes for polishing} - B24B 37/042: {operating processes therefor} - C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} - C09K 3/1409: {Abrasive particles per se (preparation of diamond C01B32/25)} - C09K 3/1463: {Aqueous liquid suspensions} - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 74/238: {comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement} - H10P 95/062: {involving a dielectric removal step} - C01F 17/235: Cerium oxides or hydroxides - C01P 2002/85: by XPS, EDX or EDAX data - C01P 2004/64: Nanometer sized, i.e. from 1-100 nanometer - C01P 2006/40: Electric properties - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C01F: COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS (metal hydrides {monoborane, diborane or addition complexes thereof} C01B6/00; salts of oxyacids of halogens C01B11/00; peroxides, salts of peroxyacids C01B15/00; sulfides or polysulfides of magnesium, calcium, strontium, or barium C01B17/42; thiosulfates, dithionites, polythionates C01B17/64; compounds containing selenium or tellurium C01B19/00; binary compounds of nitrogen with metals C01B21/06; azides C01B21/08; {compounds other than ammonia or cyanogen containing nitrogen and non-metals and optionally metals C01B21/082; amides or imides of silicon C01B21/087}; metal {imides or} amides C01B21/092, {C01B21/0923}; nitrites C01B21/50; {compounds of noble gases C01B23/0005}; phosphides C01B25/08; salts of oxyacids of phosphorus C01B25/16; carbides C01B32/90; compounds containing silicon C01B33/00; compounds containing boron C01B35/00; compounds having molecular sieve properties but not having base-exchange properties C01B37/00; compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites, C01B39/00; cyanides C01C3/08; salts of cyanic acid C01C3/14; salts of cyanamide C01C3/16; thiocyanates C01C3/20; {double sulfates of magnesium with sodium or potassium C01D5/12; with other alkali metals C01D15/00, C01D17/00}) - C01P: INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS ## Abstract A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy. ## Claims ### Claim 1 A slurry comprising abrasive grains and a liquid medium, wherein the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the at least one the metal compound contains a metal capable of taking a plurality of valences, a ratio of an atomic amount of the metal having the lowest valence of the plurality of valences to a total atomic amount of the metal is 0.10 or more in X-ray photoelectron spectroscopy, and an average particle size of the abrasive grains is 16 to 1050 nm. ### Claim 2 (depends on 1) The slurry according to claim 1, wherein the lowest valence is trivalent. ### Claim 3 (depends on 1) The slurry according to claim 1, wherein the metal contains a rare-earth metal. ### Claim 4 (depends on 1) The slurry according to claim 1, wherein the metal contains cerium. ### Claim 5 (depends on 1) The slurry according to claim 1, wherein the first particles contain at least one selected from the group consisting of silicon, vanadium, manganese, iron, cobalt, nickel, copper, silver, indium, tin, a rare earth element, tungsten, and bismuth. ### Claim 6 (depends on 1) The slurry according to claim 1, wherein the first particles contain cerium oxide. ### Claim 7 (depends on 1) The slurry according to claim 1, wherein a zeta potential of the abrasive grains is +10 mV or more. ### Claim 8 (depends on 1) A polishing method comprising a step of polishing a surface to be polished by using the slurry according to claim 1. ### Claim 9 (depends on 8) The polishing method according to claim 8, wherein the surface to be polished contains silicon oxide. ### Claim 10 (depends on 1) The slurry according to claim 1, wherein the first particles contain cerium oxide. ### Claim 11 (depends on 10) The slurry according to claim 10, wherein the second particles contain the metal hydroxide. ### Claim 12 (depends on 10) The slurry according to claim 10, wherein the second particles contain cerium hydroxide. ### Claim 13 (depends on 1) The slurry according to claim 1, wherein the second particles contain the metal hydroxide. ### Claim 14 (depends on 1) The slurry according to claim 1, wherein the second particles contain cerium hydroxide. ### Claim 15 (depends on 1) The slurry according to claim 1, wherein a particle size of the second particles is smaller than a particle size of the first particles. ### Claim 16 (depends on 1) The slurry according to claim 1, wherein a particle size of the first particles is 15 to 1000 nm. ### Claim 17 (depends on 1) The slurry according to claim 1, wherein a particle size of the second particles is 1 to 50 nm. ### Claim 18 (depends on 1) The slurry according to claim 1, wherein a content of cerium hydroxide in the abrasive grains is 5 to 50% by mass on the basis of the entire abrasive grains. ### Claim 19 (depends on 1) The slurry according to claim 1, wherein a content of the abrasive grains is 0.01 to 1% by mass on the basis of the total mass of the slurry. ### Claim 20 (depends on 1) The slurry according to claim 1, wherein pH is 2.0 to 5.0.