# US 2025/0084286 A1 · Electroconductive adhesive

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- Number: US 2025/0084286 A1
- Document ID: US20250084286A1
- Status: Published application
- Kind: A1
- Application number: 18/963,230
- Filed: 2024-11-27
- Published: 2025-03-13
- Earliest claimed: 2016-05-26
- Assignees: Osaka Soda Co., Ltd.
- Applicants: Osaka Soda Co., Ltd.
- Inventors: Takamichi MORI; Junichiro MINAMI; Naruhito IWASA
- Web page: https://patentgrep.com/patent/US20250084286A1

## CPC

- C09J 9/02: Electrically-conducting adhesives
- C09J 11/04: inorganic
- B22F 1/052: characterised by a mixture of particles of different sizes or by the particle size distribution
- B22F 1/0545: Dispersions or suspensions of nanosized particles
- B22F 1/056: {Submicron particles having a size above 100 nm up to 300 nm}
- B22F 1/102: Metallic powder coated with organic material
- B22F 7/064: {using an intermediate powder layer}
- B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)}
- C09J 5/06: involving heating of the applied adhesive
- C09J 11/06: organic
- H01B 1/22: the conductive material comprising metals or alloys
- H10W 72/30: Die-attach connectors
- B22F 9/24: starting from liquid metal compounds, e.g. solutions
- C08K 9/04: Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)}
- C08K 2003/0806: {Silver}
- C08K 2201/001: Conductive additives
- C08K 2201/003: Additives being defined by their diameter
- H10W 72/01308: {using permanent auxiliary members, e.g. using alignment marks}
- H10W 72/01935: {by plating, e.g. electroless plating or electroplating}
- H10W 72/01938: {in gaseous form, e.g. by CVD or PVD}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07334: {Using a reflow oven}
- H10W 72/07335: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 72/383: {Reinforcing structures, e.g. collars}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein: (a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise: (i) a first type of particle having an average particle diameter of 100-300 nm, and (ii) a second type of particle having an average particle diameter of 30-100 nm; and (b) the protective layer suppresses mutual aggregation of the metal fine particles A. Also disclosed are sintered objects of the electroconductive adhesive, methods of manufacturing the electroconductive adhesive and methods of bonding members with the electroconductive adhesive.

## Claims

### Claim 1

An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein:
(a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise:
(i) a first type of particle having an average particle diameter of 100-300 nm, and
(ii) a second type of particle having an average particle diameter of 30-100 nm; and
(b) the protective layer suppresses mutual aggregation of the metal fine particles A.

### Claim 2 (depends on 1)

The electroconductive adhesive according to claim 1, wherein:
(i) the first type of particle has an average particle diameter of 200 nm, and
(ii) the second type of particle has an average particle diameter of 75 nm.

### Claim 3 (depends on 1)

The electroconductive adhesive according to claim 1, wherein the C5-C7 monoalkylamine in the first type and the second type of particles is n-hexylamine.

### Claim 4 (depends on 1)

The electroconductive adhesive according to claim 1, wherein the plurality of metal fine particles A further comprises a third type of particle coated with a C5-C7 monoalkylamine, wherein the plurality of metal fine particles A has an average particle diameter of 30-100 nm.

### Claim 5 (depends on 3)

The electroconductive adhesive according to claim 3, wherein the C5-C7 monoalkylamine in the coating of the third type of particles is n-hexylamine.

### Claim 6 (depends on 1)

The electroconductive adhesive according to claim 1, wherein the protective layer of at least one of the two or more different types of particles further comprises a fatty acid.

### Claim 7 (depends on 1)

The electroconductive adhesive according to claim 1, further comprising a solvent.

### Claim 8 (depends on 1)

A sintered object of the electroconductive adhesive according to claim 1.

### Claim 9 (depends on 8)

A circuit or an apparatus comprising a part that bonds between members, wherein the part is the sintered object according to claim 8.

### Claim 10 (depends on 1)

A method of manufacturing the electroconductive adhesive according to claim 1, the method comprising a step of mixing the first type of particle with the second type of particle.

### Claim 11 (depends on 1)

A method of bonding members comprising the steps of:
disposing the electroconductive adhesive according to claim 1 between members; and
heating the electroconductive adhesive for sintering.