Curable composition, film forming method and manufacturing method

Abstract

A curable composition containing a polymerizable compound, a photopolymerization initiator, and a solvent, wherein the curable composition has a viscosity of not less than 1.3 mPa·s and not more than 60 mPa·s at 23° C. and at 1 atm, a content of the solvent with respect to whole of the curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent is not less than 135° C. at 1 atm, and defining a surface tension of a composition obtained by removing the solvent from the curable composition at 1 atm as yl [mN/m] and the surface tension of the solvent at 23° C. and at 1 atm as γ2 [mN/m], γ1 is not more than 30, γ2 is not more than 24, and γ1 is larger than γ2.

Dependencies are inferred from the claim text.