# US 2025/0084232 A1 · Liquid encapsulation resin composition and semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0084232 A1 - Document ID: US20250084232A1 - Status: Published application - Kind: A1 - Application number: 18/728,339 - Filed: 2023-01-11 - Published: 2025-03-13 - Earliest claimed: 2022-01-18 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Taisuke YAMASHITA; Hikaru OOHASI; Atsushi KISANUKI; Katsuya TANAKA - Web page: https://patentgrep.com/patent/US20250084232A1 ## CPC - C08K 3/36: Silica - C08K 5/17: Amines; Quaternary ammonium compounds - C08L 53/00: Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - H10W 74/10: characterised by their shape or disposition - H10W 74/40: characterised by their materials - C08K 2201/005: Additives being defined by their particle size in general - H10W 72/354: {comprising polymers} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A liquid encapsulation resin composition contains a silica (A), an epoxy resin (B), a curing agent (C), a curing accelerator (D), and a triblock copolymer (E) expressed by the formula (1): X−Y−X, where X is a segment block including a polymer of methyl methacrylate and Y is a segment block including a polymer of monomer components containing 2-ethylhexyl acrylate. The percentage of the triblock copolymer (E) to the total of the epoxy resin (B), the curing agent (C), and the curing accelerator (D) is equal to or greater than 1.0% by mass and equal to or less than 9.5% by mass. ## Claims ### Claim 1 A liquid encapsulation resin composition containing a silica (A), an epoxy resin (B), a curing agent (C), a curing accelerator (D), and a triblock copolymer (E) expressed by the following formula (1): X—Y—X (1) where X is a segment block configured as a polymer of methyl methacrylate and Y is a segment block configured as a polymer of monomer components containing 2-ethylhexyl acrylate, and percentage of the triblock copolymer (E) to a total of the epoxy resin (B), the curing agent (C), and the curing accelerator (D) being equal to or greater than 1.0% by mass and equal to or less than 9.5% by mass. ### Claim 2 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the monomer components further contain butyl acrylate. ### Claim 3 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the triblock copolymer (E) has a weight average molecular weight equal to or greater than 40,000 and equal to or less than 100,000. ### Claim 4 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the epoxy resin (B) is in liquid form at 25° C. ### Claim 5 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the curing agent (C) contains an aromatic amine-based curing agent (C-1). ### Claim 6 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein a functional group equivalent ratio of the epoxy resin (B) to the curing agent (C) is equal to or greater than 0.6 and equal to or less than 1.4. ### Claim 7 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the liquid encapsulation resin composition has, at 25° C., a viscosity equal to or greater than 1.0 Pa·s and equal to or less than 50.0 Pa·s. ### Claim 8 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the liquid encapsulation resin composition has, at 25° C., a thixotropic index equal to or greater than 0.5 and equal to or less than 1.2. ### Claim 9 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the liquid encapsulation resin composition has a viscosity equal to or greater than 0.01 Pa·s and equal to or less than 1.00 Pa·s at a temperature equal to or higher than 90° C. and equal to or lower than 170° C. ### Claim 10 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the silica (A) is a spherical fused silica, and the silica (A) has a maximum particle size equal to or less than 10.0 μm. ### Claim 11 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein percentage of the silica (A) to the liquid encapsulation resin composition is equal to or greater than 40.0% by mass and equal to or less than 80.0% by mass. ### Claim 12 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein a cured product of the liquid encapsulation resin composition has an elastic modulus equal to or greater than 2.0 GPa and equal to or less than 8.0 GPa. ### Claim 13 (depends on 1) The liquid encapsulation resin composition of claim 1, wherein the liquid encapsulation resin composition is used as a capillary underfill material. ### Claim 14 (depends on 1) A semiconductor device comprising: a substrate; a semiconductor element; and an encapsulant filling a gap between the substrate and the semiconductor element, the encapsulant including a cured product of the liquid encapsulation resin composition of claim 1.