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US 2025/0083272 A1Published application
Wafer placement table
AssigneeNGK Insulators, Ltd.
InventorsKeita MINE, Yohei KAJIURA
Life of this patent
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Abstract
A wafer placement table includes a ceramic plate having a wafer placement surface on its upper surface, a cooling plate on a lower surface of the ceramic plate, a refrigerant flow path in the cooling plate, and an insulating hole located beside the refrigerant flow path in the cooling plate and extending from a lower surface of the cooling plate to a ceiling located higher than 2/3 of a height of the refrigerant flow path from its bottom.
Claims6
A wafer placement table comprising:
- a ceramic plate having a wafer placement surface on its upper surface;
- a cooling plate on a lower surface of the ceramic plate;
- a refrigerant flow path in the cooling plate;
- and
- an insulating hole located beside the refrigerant flow path in the cooling plate and extending from a lower surface of the cooling plate to a ceiling located higher than 2/3 of a height of the refrigerant flow path from its bottom.
2 more elements
Dependencies are inferred from the claim text.