# US 2025/0083181 A1 · Conductive molded enclosure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0083181 A1 - Document ID: US20250083181A1 - Status: Published application - Kind: A1 - Application number: 18/828,349 - Filed: 2024-09-09 - Published: 2025-03-13 - Earliest claimed: 2023-09-07 - Applicants: Hoffman Enclosures Inc. - Inventors: William Joseph Nepsha; Steven Kurtzweg; Ryan Gaveske; Jennifer Ollila - Web page: https://patentgrep.com/patent/US20250083181A1 ## CPC - B05D 1/06: Applying particulate materials - B05D 3/0254: {After-treatment} - B05D 7/02: to macromolecular substances, e.g. rubber (treatment or coating of shaped articles made of macromolecular substances C08J7/00) - B29C 70/882: {partly or totally electrically conductive, e.g. for EMI shielding (conductive floors or floor coverings H05F3/025; EMI shielding in general H05K9/00)} - B05D 2201/02: Polymeric substrate - B05D 2301/00: Inorganic additives or organic salts thereof - B05D 2401/32: applied as powders - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) ## Abstract A method of painting an enclosure can included providing an enclosure formed from a conductive sheet molding compound. A powder coating can be applied to at least one surface of the enclosure, and the powder coating can be cured by heating the enclosure at a curing temperature. ## Claims ### Claim 1 A method of painting an enclosure, the method comprising: providing an enclosure formed from conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics; electrostatically applying a powder coating to at least one surface of the enclosure; and curing the powder coating by heating the enclosure at a curing temperature. ### Claim 2 (depends on 1) The method of claim 1, wherein the powder coating is applied to each exterior surface of the side walls. ### Claim 3 (depends on 2) The method of claim 2, wherein the powder coating is applied to each exterior surface of the enclosure. ### Claim 4 (depends on 3) The method of claim 3, wherein the power coating is applied to the side walls within the internal cavity. ### Claim 5 (depends on 1) The method of claim 1, further comprising: providing a cover of the enclosure also formed from conductive sheet molding compound and sized to close an opening into the internal cavity; and electrostatically applying a powder coating to at least one surface of the cover. ### Claim 6 (depends on 5) The method of claim 5, wherein the powder coating is applied to each exterior surface of the cover. ### Claim 7 (depends on 6) The method of claim 6, wherein the enclosure includes a seamless body that defines the internal cavity and a conductive outer surface. ### Claim 8 (depends on 1) The method of claim 1, wherein the conductive sheet molding compound includes a conductive additive that is carbon-based. ### Claim 9 (depends on 8) The method of claim 8, wherein the conducting additive is between 0.1 wt. % and 5 wt. %. ### Claim 10 (depends on 8) The method of claim 8, wherein the conducting additive is selected from the group consisting of carbon black, carbon microparticles, carbon nanoparticles, carbon nanotubes, carbon sheets, and mixtures thereof. ### Claim 11 (depends on 8) The method of claim 8, wherein the wherein the conductive sheet molding compound further comprises a flame retardant. ### Claim 12 (depends on 1) The method of claim 1, wherein the curing temperature is between about 120° C. (250° F.) and about 175° C. (350° F.). ### Claim 13 An enclosure comprising: an enclosure body formed integrally from conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics and define an opening into the internal cavity; and a cover formed from the conductive sheet molding compound and sized to block the opening into the internal cavity. ### Claim 14 (depends on 13) The enclosure of claim 13, wherein the enclosure body is a grounded body via the conductive sheet molding compound. ### Claim 15 (depends on 14) The enclosure of claim 14, wherein the enclosure body defines a conductive outer surface that extends onto protruding grounding attachment points. ### Claim 16 (depends on 13) The enclosure of claim 13, further comprising a cured powder coating on at least one surface of the enclosure body or the cover. ### Claim 17 (depends on 16) The enclosure of claim 16, wherein the cured powder coating is a powder paint coating that colors the enclosure. ### Claim 18 (depends on 13) The enclosure of claim 13, wherein the conductive sheet molding compound comprises a conducting additive selected from the group consisting of carbon black, carbon microparticles, carbon nanoparticles, carbon nanotubes, carbon sheets, and mixtures thereof. ### Claim 19 A method of grounding an enclosure, the method comprising: providing an enclosure formed from a conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics; and securing a grounding connection at a conductive outer surface of the enclosure. ### Claim 20 (depends on 19) The method of claim 19, further comprising: electrostatically applying a powder coating to at least one surface of the enclosure; and curing the powder coating by heating the enclosure at a curing temperature.