Buffer configurations for communications between memory dies and a host device
AssigneeMicron Technology, Inc.
InventorsSujeet V. Ayyapureddi, Brent Keeth, Matthew A. Prather
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AssigneeMicron Technology, Inc.
InventorsSujeet V. Ayyapureddi, Brent Keeth, Matthew A. Prather
Estimating the term…
Methods, systems, and devices for buffer configurations for communications between memory dies and a host device are described. A memory device may include a buffer having a first interface coupled with a host device and a second interface coupled with a memory die of the memory device. The first interface may communicate information with the host device at a first frequency and according to a first signaling scheme, and the second interface may communicate information with the memory die at a second frequency and according to a second signaling scheme. The first frequency may be higher than the second frequency, and the second signaling scheme may include a greater quantity of voltage levels than the first signaling scheme.
A system, comprising:
An apparatus, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.