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US 2025/0076141 A1Published application
Sensor Having a Package with a Sensor Die
AssigneeTE Connectivity Solutions GmbH
InventorsDavid Eric Wagner, Weijun (Davy) Xie, Vincent Wong
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Abstract
A sensor includes a housing having a body and a plurality of ports, a plurality of diaphragms each disposed in one of the ports, and a package having a substrate and a sensor die attached to the substrate. The body has a first face and an opposite second face. The ports extend from the first face of the body. The substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate.
Claims20
A sensor, comprising:
- a housing having a body and a plurality of ports, the body has a first face and an opposite second face, the ports extend from the first face of the body;
- a plurality of diaphragms each disposed in one of the ports;
- and
- a package having a substrate and a sensor die attached to the substrate, the substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate.
1 more element
Dependencies are inferred from the claim text.