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US 2025/0074159 A1Published application
Arrangement for a temperature control circuit
AssigneeTi Automotive Technology Center GmbH
InventorsSebastian Brixner, Werner Merz, Gerhard Kolb, Philip Sarstedt, Konrad Kocurek, Nicolas Hoss, Pawel Rojek, Christian Henning
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Abstract
An arrangement for a temperature control circuit including a housing in which at least one channel is formed for transporting temperature control media, wherein the wall of the housing is formed from sheet metal.
Claims15
An arrangement for a temperature control circuit, comprising a housing in which at least one channel is formed for transporting temperature control media, wherein the wall of the housing is formed from sheet metal.
Dependencies are inferred from the claim text.