Method For Joining Metal Materials And Controlling Bonding Quality Thereof
AssigneeToyama Prefecture
InventorHideki YAMAGISHI
Life of this patent
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Abstract
The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.
Claims7
A method for joining metal materials, comprising applying a spot load with a die and a punch to a joint part between similar aluminum-based various metal materials consisting of a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other without mechanical joining due to undercutting around the joint part, wherein a plastic flow is produced at a bonding interface so as to perform a solid phase diffusion bonding at a bonding interface temperature of 270 to 450° C.,
- wherein when a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a reduction ratio, the reduction ratio R is 1.8 or more.
A method for controlling a bonding quality of metal materials, comprising controlling with a reduction ratio R the bonding quality of similar aluminum-based various metal materials consisting of a first metal material and a second metal material to which a spot load is applied at a joint part between the first metal material and the second metal material in a state where sites to form the joint part are superposed on each other without mechanical joining due to undercutting around the joint part, wherein a plastic flow is produced at a bonding interface so as to perform a solid phase diffusion bonding at a bonding interface temperature of 270 to 450° C.,
- wherein when a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as the reduction ratio.
Dependencies are inferred from the claim text.