Semiconductor package and method of manufacturing the semiconductor package

A method of manufacturing a semiconductor package, the method comprising:

• forming a lower redistribution wiring layer having a central region and a peripheral region surrounding the central region, the lower redistribution wiring layer having bonding pads that are exposed from an upper surface thereof;
• forming a photosensitive insulating layer on the upper surface of the lower redistribution wiring layer;
• radiating a first light having a first wavelength onto the photosensitive insulating layer through a first mask to form a first hardened portion in the central region;
• radiating a second light having a second wavelength greater than the first wavelength onto the photosensitive insulating layer through a second mask to form a second hardened portion on the bonding pads, the second hardened portion surrounding through opening regions;
• removing the photosensitive insulating layer in the through opening regions and at least a portion of the first hardened portion;
• forming conductive structures on the bonding pads in the through opening regions;
• and
• removing the second hardened portion and the remainder of the first hardened portion using a strip solution.

A method of manufacturing a semiconductor package, the method comprising:

• forming a lower redistribution wiring layer having a central region and a peripheral region surrounding the central region, the lower redistribution wiring layer having bonding pads that are exposed from an upper surface thereof;
• forming a photosensitive insulating layer on the upper surface of the lower redistribution wiring layer;
• forming a first hardened portion having a first hardness on the central region by radiating a first light having a first wavelength on the photosensitive insulating layer;
• forming a second hardened portion having a second hardness higher than the first hardness by radiating a second light having a second wavelength greater than the first wavelength onto the photosensitive insulating layer, the second hardened portion surrounding through opening regions on the bonding pads;
• removing the photosensitive insulating layer on the through opening regions and at least a portion of the first hardened portion;
• and
• forming conductive structures on the bonding pads in the through opening regions;
• and
• removing the second hardened portion and the remainder of the first hardened portion through a strip solution.