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US 2025/0066905 A1Published application
Methods and systems for filling a gap
AssigneeASM IP Holding B.V.
InventorsRené Henricus Jozef Vervuurt, Timothee Blanquart, Charles Dezelah
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Abstract
Disclosed are methods and systems for filling a gap. A method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises at least partially filling the gap with a gap filling fluid. The method then comprises subjecting the gap filling fluid to a transformation treatment, thus forming a transformed material in the gap. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
Claims17
A method for filling a gap, the method comprising:
- providing a substrate to a reaction chamber, the substrate comprising the gap;
- providing a metal precursor into the reaction chamber in vapor phase;
- providing a halogen precursor into the reaction chamber in vapor phase, thereby forming a gap filling fluid;
- and
- exposing the gap filling fluid to a transformation reactant, thereby converting at least part of the gap filling fluid into a transformed material.
2 more elements
A method for filling a gap, the method comprising:
- providing a substrate, the substrate comprising the gap;
- providing a system comprising a gap filling fluid reaction chamber and a transformation reaction chamber;
- executing a plurality of super cycles, a super cycle comprising:
- moving the substrate into the gap filling fluid reaction chamber;
- forming a gap filling fluid in the gap filling fluid reaction chamber, thereby at least partially filling the gap with the gap filling fluid;
- moving the substrate into the transformation reaction chamber;
- and
- subjecting the substrate to a transformation treatment in the transformation reaction chamber, thereby converting at least a part of the gap filling fluid into a transformed material.
5 more elements
Dependencies are inferred from the claim text.