# US 2025/0066534 A1 · Process for preparing a reshapable thermoset resin material

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- Number: US 2025/0066534 A1
- Document ID: US20250066534A1
- Status: Published application
- Kind: A1
- Application number: 18/722,094
- Filed: 2022-12-19
- Published: 2025-02-27
- Earliest claimed: 2021-12-22
- Assignees: Syensqo SA
- Applicants: Syensqo SA
- Inventors: Rakhi SOOD; Vinayak VALODKAR; Hemang DARJI; Xavier REVEST
- Web page: https://patentgrep.com/patent/US20250066534A1

## CPC

- C08G 59/38: together with di-epoxy compounds
- C08G 59/245: {aromatic}
- C08G 59/3227: {Compounds containing acyclic nitrogen atoms}
- C08G 59/5073: {having two nitrogen atoms in the ring}
- C08G 59/508: {having three nitrogen atoms in the ring}
- C08G 59/686: {containing nitrogen}
- C08G 2280/00: Compositions for creating shape memory
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A process for preparing a reshapable thermoset resin material comprising curing epoxy resin wherein curing is carried out with (a) at least one imidazole compound and (b) at least one benzotriazole compound.

## Claims

### Claim 1

A process for preparing a reshapable thermoset resin material comprising mixing epoxy resin with (a) at least one imidazole compound and (b) at least one benzotriazole compound to form a mixture, and curing the mixture.

### Claim 2 (depends on 1)

The process according to claim 1, wherein the epoxy resin comprises one or more epoxy resins.

### Claim 3 (depends on 2)

The process according to claim 2, wherein the epoxy resin is a mixture of a bifunctional epoxy resin and a trifunctional epoxy resin.

### Claim 4 (depends on 3)

The process according to claim 3, wherein the epoxy resin is a mixture of diglycidyl ether of bisphenol A (DGEBA) and triglycidyl para-aminophenol (TGAP).

### Claim 5 (depends on 3)

The process according to claim 3, wherein the bifunctional epoxy resin is added in amounts from 65 wt % to 100 wt % relative to the total quantity of epoxy resins.

### Claim 6 (depends on 3)

The process according to claim 3, wherein the trifunctional epoxy resin is added in amounts from 25 wt % to 65 wt % relative to the total quantity of epoxy resins.

### Claim 7 (depends on 3)

The process according to claim 3, wherein the amount of bifunctional epoxy resin is from 50 wt % to 90 wt % and amount of trifunctional epoxy resin is 50 wt % to 10 wt % in the mixture of bifunctional epoxy resin and trifunctional epoxy resin.

### Claim 8 (depends on 1)

The process according to claim 1, wherein the benzotriazole compound is added in amounts from 5 to 50 parts by weight per one hundred parts by weight of the epoxy resin.

### Claim 9 (depends on 1)

The process according to claim 1, wherein the imidazole compound is added in amounts from 0.1 to 3.5 parts by weight per one hundred parts by weight of the epoxy resin.

### Claim 10 (depends on 1)

The process according to claim 1, wherein imidazole compound is 1-methyl imidazole.

### Claim 11 (depends on 1)

The process according to claim 1, wherein epoxy resin and benzotriazole compound are mixed first and imidazole compound is added to the mixture.

### Claim 12 (depends on 1)

A reshapable thermoset resin material obtained by the process according to claim 1.