Environmental sensor and method for operating an environmental sensor
OwnerDavid Slogsnat, Domenico Tangredi +3inventors
InventorsDavid Slogsnat, Domenico Tangredi, Joachim Kreutzer, Manuel Salvatore Santoro, Massimiliano Musazzi
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Abstract
An environmental sensor. The environmental sensor includes: a MEMS element; an ASIC element electrically connected to the MEMS element by means of at least two bonding wires. T ASIC element includes an evaluation circuit designed to ascertain and evaluate a parasitic capacitance between the at least two bonding wires connected to pads of the MEMS element, in order to detect a material deposit on the environmental sensor.
Claims14
1-13. (canceled)
An environmental sensor, comprising:
- a MEMS element;
- and
- an ASIC element electrically connected to the MEMS element using at least two bonding wires, wherein the ASIC element includes an evaluation circuit configured to ascertain and evaluate a parasitic capacitance between the at least two bonding wires connected to pads of the MEMS element, to detect a material deposit on the environmental sensor.
A method for operating an environmental sensor, wherein the environmental sensor including a MEMS element including a first pad and a second pad, wherein a first bonding wire is connected to the first pad and a second bonding wire is connected to the second pad, the method comprising the following steps:
- applying an electrical actuation signal to the first bonding wire, wherein the first bonding wire is capacitively coupled to the second bonding wire;
- ascertaining a parasitic capacitance formed between the first and second bonding wires;
- evaluating the ascertained parasitic capacitance;
- and
- signaling a result of the evaluation.
A non-transitory computer-readable data carrier on which is stored a computer program with program code for operating an environmental sensor, wherein the environmental sensor including a MEMS element including a first pad and a second pad, wherein a first bonding wire is connected to the first pad and a second bonding wire is connected to the second pad, the program code, when executed by an ASIC element, causing the ASIC element to perform the following steps:
- applying an electrical actuation signal to the first bonding wire, wherein the first bonding wire is capacitively coupled to the second bonding wire;
- ascertaining a parasitic capacitance formed between the first and second bonding wires;
- evaluating the ascertained parasitic capacitance;
- and
- signaling a result of the evaluation.
Dependencies are inferred from the claim text.