Method and system for forming grooves in a board element and an associated panel
AssigneeCeraloc Innovation AB
InventorsPer JOSEFSSON, Richard JOLFSON
Life of this patent
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Abstract
A method for forming grooves in a board element. An exemplary method includes arranging the board element in contact with a support member, and forming at least one groove in a rear side of the board element by removing material, such as chips, from the board element by rotating one or more cutting devices including a plurality of tooth elements configured to rotate around a rotational axis. A method further includes counteracting, such as preventing, a displacement of the board element away from the support member during forming of the at least one groove, wherein the counteracting, such as preventing, includes arranging at least a portion of the board element between an obstruction element and the support member.
Claims18
A method for forming grooves in a board element, comprising:
- arranging the board element in contact with a support member;
- forming at least one groove in a rear side of the board element by removing material from the board element by a processing tool;
- and
- separating the removed material into a first and a second group of material elements, a characteristic of material elements of the first group being different from a corresponding characteristic of material elements of the second group,
- wherein the characteristic is at least one selected from the group of a material composition of the material elements, a size of the material elements, a weight of the material, a shape of the material, and a density of the material.
Dependencies are inferred from the claim text.