Mask-support assembly and producing method thereof
AssigneeOlum Material Corporation
InventorsTaek Yong JANG, Young Ho LEE
Life of this patent
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Abstract
The present invention relates to a mask-support assembly and a producing method thereof. The mask-support assembly according to the present invention is used in a process of forming organic light emitting diode (OLED) pixels on a semiconductor wafer, and may include a support including an edge portion and a grid portion; and a mask connected onto the support and including a plurality of cell portions with mask patterns formed therein, wherein at least a part of the mask is disposed in a trench portion recessed in the support.
Claims20
A mask-support assembly for use in a process of forming organic light emitting diode (OLED) pixels on a semiconductor wafer, the mask-support assembly comprising:
- a support including an edge portion and a grid portion;
- and
- a mask connected onto the support and including a plurality of cell portions with mask patterns formed therein,
- wherein at least a part of the mask is disposed in a trench portion recessed in the support.
A producing method of a mask-support assembly for use in a process of forming organic light emitting diode (OLED) pixels on a semiconductor wafer, the producing method comprising the steps of:
- (a) preparing a support which includes a first surface and a second surface opposite to the first surface and is a conductive substrate;
- (b) forming a recessed trench portion on the first surface;
- (c) forming a mask on the first surface of the support by electroforming;
- (d) performing heat treatment on the support and the mask;
- and
- (e) forming an edge portion and a grid portion by etching the support on the second surface of the support,
- wherein in step (c), the mask is formed at least within the trench portion.
Dependencies are inferred from the claim text.