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US 2025/0063876 A1Published application
Semiconductor light emitting device and method for manufacturing the same
AssigneeRohm Co., Ltd.
InventorsMasahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
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Abstract
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
Claims15
A light emitting device comprising:
- a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion;
- a second lead spaced apart from the first lead in a first direction;
- at least one semiconductor light source bonded on the first lead, one of the at least one semiconductor light source being electrically connected to the second lead;
- a resin package supporting the first lead and the second lead, the resin package having at least one straight edge in plan view;
- and
- a sealing resin covering the at least one semiconductor light source,
- wherein the at least one straight edge of the resin package comprises an inner straight edge extending to cross the first thick portion in plan view.
4 more elements
Dependencies are inferred from the claim text.