Manufacturing method of electronic device
AssigneeInnolux Corporation
InventorChen-Kuan KAO
Life of this patent
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Abstract
A manufacturing method of an electronic device includes: providing a substrate; disposing a conductive layer on the substrate; performing a patterning step to pattern the conductive layer, such that a grid structure having a plurality of grid units is formed in the conductive layer, and the conductive layer which is patterned includes a first portion and a second portion at least; and performing an electroplating step to electroplate at least one of the first portion and the second portion, such that a thickness of the first portion is different from a thickness of the second portion after performing the electroplating step.
Claims20
A manufacturing method of an electronic device, comprising:
- providing a substrate;
- disposing a conductive layer on the substrate;
- performing a patterning step to pattern the conductive layer, such that a grid structure having a plurality of grid units is formed in the conductive layer, and the conductive layer which is patterned comprises a first portion and a second portion at least;
- and
- performing an electroplating step to electroplate at least one of the first portion and the second portion, such that a thickness of the first portion is different from a thickness of the second portion after performing the electroplating step.
A manufacturing method of an electronic device, comprising:
- providing a substrate;
- and
- performing an inkjet printing step to form a conductive layer on the substrate;
- wherein the conductive layer comprises a grid structure having a plurality of grid units, the conductive layer comprises a first portion and a second portion at least, and a thickness of the first portion is different from a thickness of the second portion.
Dependencies are inferred from the claim text.