Fin field effect transistors having vertically stacked nano-sheet
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWang-Chun Huang, Chih-Hao Wang, Ching-Wei Tsai, Kuan-Lun Cheng
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWang-Chun Huang, Chih-Hao Wang, Ching-Wei Tsai, Kuan-Lun Cheng
Estimating the term…
The present disclosure describes a structure including a fin field effect transistor (finFET) and a nano-sheet transistor on a substrate and a method of forming the structure. The method can include forming first and second vertical structures over a substrate, where each of the first and the second vertical structures can include a buffer region and a first channel layer formed over the buffer region. The method can further include disposing a masking layer over the first channel layer of the first and second vertical structures, removing a portion of the first vertical structure to form a first recess, forming a second channel layer in the first recess, forming a second recess in the second channel layer, and disposing an insulating layer in the second recess.
A structure, comprising:
A structure, comprising:
A structure, comprising:
Dependencies are inferred from the claim text.