Semiconductor device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsChang-Yih Chen, Kuo-Hsing Lee, Chun-Hsien Lin, Kun-Szu Tseng, Sheng-Yuan Hsueh, Yao-Jhan Wang
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AssigneeUnited Microelectronics Corp.
InventorsChang-Yih Chen, Kuo-Hsing Lee, Chun-Hsien Lin, Kun-Szu Tseng, Sheng-Yuan Hsueh, Yao-Jhan Wang
Estimating the term…
A method for fabricating a semiconductor device includes the steps of first providing a substrate having a non-metal-oxide semiconductor capacitor (non-MOSCAP) region and a MOSCAP region, forming a first fin-shaped structure on the MOSCAP region, performing a monolayer doping (MLD) process on the first fin-shaped structure, and then performing an anneal process for driving dopants into the first fin-shaped structure. Preferably, the MLD process is further accomplished by first performing a wet chemical doping process on the first fin-shaped structure and then forming a cap layer on the non-MOSCAP region and the MOSCAP region.
A method for fabricating a semiconductor device, comprising:
A semiconductor device, comprising:
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