Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsIkuo FUJIWARA, Tatsuo SHIMIZU, Masahiko KURAGUCHI, Aya SHINDOME, Daimotsu KATO
Life of this patent
Estimating the term…
Loading patent…
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsIkuo FUJIWARA, Tatsuo SHIMIZU, Masahiko KURAGUCHI, Aya SHINDOME, Daimotsu KATO
Estimating the term…
According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor member, a second semiconductor member, a first compound member, and a first insulating member. The third electrode includes a first electrode portion. The first semiconductor member includes Alx1Ga1-x1N (0≤x1<1). The first semiconductor member includes first to seventh partial regions. The second semiconductor member includes Alx2Ga1-x2N (0<x2≤1, x1<x2). The second semiconductor member includes first and second semiconductor portions. The first compound member includes Alz1Ga1-z1N (0<z1≤1, x2<z1). The first compound member includes first to fifth regions. The first insulating member includes first and second insulating portions. At least a part of the first insulating portion and at least a part of the second insulating portion is amorphous.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.