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US 2025/0063667 A1Published application
Electronic assembly and manufacturing method thereof
AssigneeASUSTeK COMPUTER INC.
InventorsChih-Kuan Liu, Xu Wang
Life of this patent
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Abstract
An electronic assembly includes a substrate, a chip configured on the substrate, a cover component configured on the chip, a capacitance element configured on the substrate, and a sealing structure surrounding the chip and sealing a gap between the cover component and the substrate. The sealing structure includes an insulating gel encapsulating the capacitance element. In addition, a manufacturing method of the electronic assembly is also provided.
Claims20
An electronic assembly, comprising:
- a substrate;
- a chip, configured on the substrate;
- a cover component, configured on the chip;
- a capacitance element, configured on the substrate;
- and
- a sealing structure, surrounding the chip, and sealing a gap between the cover component and the substrate, wherein the sealing structure comprises an insulating gel, and the insulating gel encapsulates the capacitance element.
3 more elements
A manufacturing method of an electronic assembly, comprising:
- providing a substrate, wherein a chip and a capacitance element are provided on the substrate;
- providing a sealing structure on the substrate to surround the chip;
- and
- configuring a cover component on the chip, so that the sealing structure seals a gap between the cover component and the substrate,
- wherein the sealing structure comprises an insulating gel, and the step of providing the sealing structure comprises:
- encapsulating the capacitance element using the insulating gel;
- and
- defining a shape of the insulating gel by a jig and curing the insulating gel.
5 more elements
Dependencies are inferred from the claim text.