Multilayer substrate and jig
AssigneeNidec Advance Technology Corporation
InventorsShigeki SAKAI, Kazuo KIMURA, Masanobu YAGI
Life of this patent
Estimating the term…
Abstract
A pitch conversion module includes a plurality of double-sided substrates including a first metal pattern formed on an upper surface, a second metal pattern formed on a lower surface, and a metal via connecting the first metal pattern and the second metal pattern, and a first conductive paste via formed of conductive paste connecting the first metal pattern and the second metal pattern between the double-sided substrates adjacent to each other in a double-sided substrate block in which a plurality of the double-sided substrates are stacked.
Claims13
A multilayer substrate comprising:
- a plurality of double-sided substrates including a first metal pattern formed on one surface, a second metal pattern formed on another surface, and a metal via connecting the first and second metal patterns;
- and
- a first conductive paste via formed of conductive paste that connects the first metal pattern and the second metal pattern between the double-sided substrates adjacent to each other in a double-sided substrate block in which the plurality of double-sided substrates are stacked,
- wherein
- a conductive path is formed from the first metal pattern in the double-sided substrate on the one side of a pair of the double-sided substrates adjacent to each other to the second metal pattern via the metal via, the second metal pattern, the first conductive paste via, the first metal pattern in a double-sided substrate on another side, and the metal via.
A multilayer substrate comprising:
- three or more double-sided substrates including a first metal pattern formed on one surface, a second metal pattern formed on another surface, and a metal via connecting the first and second metal patterns;
- in a double-sided substrate block in which the three or more double-sided substrates are stacked,
- a first conductive paste via formed of conductive paste that connects the first metal pattern and the second metal pattern between a pair of the double-sided substrates adjacent to each other;
- and
- a fourth conductive paste via formed of conductive paste that connects the second metal pattern of a double-sided substrate on the another side of the pair of double-sided substrates and a first metal pattern of a double-sided substrate adjacent to the another side of a double-sided substrate including the second metal pattern.
A jig comprising:
- a multilayer substrate comprising:
- three or more double-sided substrates including a first metal pattern formed on one surface, a second metal pattern formed on another surface, and a metal via connecting the first and second metal patterns;
- in a double-sided substrate block in which the three or more double-sided substrates are stacked,
- a first conductive paste via formed of conductive paste that connects the first metal pattern and the second metal pattern between a pair of the double-sided substrates adjacent to each other;
- and
- a fourth conductive paste via formed of conductive paste that connects the second metal pattern of a double-sided substrate on the another side of the pair of double-sided substrates and a first metal pattern of a double-sided substrate adjacent to the another side of a double-sided substrate including the second metal pattern;
- and
- a contact capable of contacting an inspection object to perform electrical inspection,
- wherein the contact and the multilayer substrate are electrically connected.
Dependencies are inferred from the claim text.