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US 2025/0063659 A1Published application
Edge mount memory connector with staggered footprint pins
AssigneeIntel Corporation
InventorLandon HANKS
Life of this patent
Estimating the term…
Abstract
A dual inline memory module (DIMM) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. The signals pins are staggered with alternating signal pins being longer and shorter. Longer pins have corresponding signal pads on the system board farther away from the connector than corresponding signals pads for the shorter pins.
Claims18
A connector comprising:
- a housing;
- a first signal pin having a first length from a first foot to a first end of the first signal pin;
- a second signal pin having a second length from a second foot to a second end of the second signal pin, the first length longer than the second length, wherein the first foot is further from a center of the housing than the second foot;
- and
- a ground pin between the first signal pin and the second signal pin.
2 more elements
A computer system comprising:
- a motherboard including a first surface with first ground pads to couple to second ground pads of a dual inline memory module (DIMM) board and first signal pads to couple to second signal pads of the DIMM board;
- and
- a connector including:
- a housing;
- a first signal pin having a first length from a first foot to a first end of the first signal pin;
- a second signal pin having a second length from a second foot to a second end of the second signal pin, the first length longer than the second length, wherein the first foot is further from a center of the housing than the second foot;
- and
- a ground pin between the first signal pin and the second signal pin.
5 more elements
Dependencies are inferred from the claim text.