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US 2025/0063658 A1Published application
Via and pad arrangement for printed circuit board
AssigneeCisco Technology, Inc.
InventorsMike Sapozhnikov, David Nozadze, Joel Richard Goergen, Wenbin Ma, Upen Reddy Kareti, Weiying Ding
Life of this patent
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Abstract
In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.
Claims20
An apparatus, comprising:
- a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB;
- and
- a via formed through the pad, wherein the via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.
An apparatus, comprising:
- a pad of a printed circuit board (PCB), wherein the pad is configured to couple to an electrical component separate from the PCB;
- a trace configured to propagate a signal;
- and
- a via formed through the pad, wherein the via is electrically separate from the trace, and the via is offset from a center of the pad such that crosstalk associated with the trace is below a threshold level.
1 more element
A method, comprising:
- positioning a pad on a surface of a printed circuit board (PCB);
- and
- forming a via through the pad at a position offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance to limit crosstalk associated with the most adjacent trace below a threshold level.
Dependencies are inferred from the claim text.