Printed circuit board (pcb) module comprising an embedded radio-frequency semiconductor die
AssigneeGN Hearing A/S
InventorsMaja Amskov Gravad, Søren Christian Ell
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Abstract
A printed circuit board (PCB) module comprising a unitarily formed multilayer PCB, where the multilayer PCB comprises a plurality of layers, the plurality of layers comprising interleaved conductive and non-conductive layers, a first outer surface and an opposing second outer surface, the first outer surface comprising one or more components, the second outer surface comprising one or more electrical contacts such as solder bumps, and a first embedded semiconductor die having an active side facing the first outer surface, wherein the first embedded semiconductor die comprises a wireless radio-frequency transceiver such as a Bluetooth-compliant transceiver.
Claims17
A printed circuit board (PCB) module comprising a multilayer PCB, the multilayer PCB comprising:
- a plurality of layers comprising conductive layers and non-conductive layers;
- a first outer surface and second outer surface opposite from the first outer surface;
- one or more electrical components coupled to the first outer surface of the multilayer PCB;
- one or more electrical contacts coupled to the second outer surface of the multilayer PCB;
- and
- a first embedded semiconductor die having an active side facing towards a location of the first outer surface;
- wherein the first embedded semiconductor die comprises a first wireless radio-frequency transceiver located between two of the layers of the multilayer PCB.
Dependencies are inferred from the claim text.