Temperature regulation of integrated circuit elements

A semiconductor package, comprising:

• a substrate;
• an analog circuitry that is formed on the substrate;
• a first heating element that is formed on the substrate;
• a first temperature sensing element that is formed on the substrate;
• a first heating control circuitry that is formed on the substrate, the first heating control circuitry being configured to detect whether a first temperature measurement that is taken with the first temperature sensing element is below a first threshold, and turn on the first heating element in response to detecting that the first temperature measurement is below the first threshold, the first heating element being turned on only when the first temperature measurement is below the first threshold;
• and
• an encapsulating material configured to encapsulate the substrate, the analog circuitry, the first temperature sensing element, the first heating element, and the first heating control circuitry.

A method for use in a semiconductor package, comprising:

• receiving a temperature measurement that is taken by a temperature sensing element disposed inside the semiconductor package;
• detecting whether the temperature measurement is below a first threshold;
• in response to detecting that the temperature measurement is below the first threshold, turning on a heating element that is disposed inside the semiconductor package, the heating element being turned on only when the temperature measurement is below the first threshold,
• wherein the heating element is formed on a same substrate as a sensing element, the heating element is configured to heat the sensing element, and the heating element and the sensing element are encapsulated inside an encapsulating material that is used to form the semiconductor package.

A semiconductor package, comprising:

• means for taking a temperature measurement inside the semiconductor package;
• means for detecting whether the temperature measurement is below a first threshold;
• means for turning on a heating element that is disposed inside the semiconductor package in response to sensing that the temperature measurement is below the first threshold, the heating element being turned on only when the temperature measurement is below the first threshold,
• wherein the heating element is arranged to heat a sensing element is part of the semiconductor package.