Encapsulation of side-emitting laser packages by means of vacuum injection molding

A light emitting component comprising:

• at least one edge-emitting semiconductor element comprising a laser facet,
• wherein the edge-emitting semiconductor element is arranged on a carrier and is at least partially surrounded by a cap, which comprises a light emitting surface in a beam direction,
• wherein the cap is made by a vacuum injection molding process, and
• wherein the light emitting surface directly adjoins the laser facet of the edge-emitting semiconductor element.

A method for manufacturing a plurality of light emitting components each comprising at least one light emitting semiconductor element, the method comprising:

• providing a printed circuit board substrate;
• encapsulating a portion of the printed circuit board substrate with a curable plastic to produce an encapsulation;
• arranging, fixing and wiring a plurality of semiconductor elements on the printed circuit board substrate, the plurality of semiconductor elements forming edge-emitting semiconductor lasers having a laser facet;
• inserting the printed circuit board substrate with the semiconductor elements into a lower mold tool;
• placing an upper mold tool on the lower mold tool so that the printed circuit board substrate is accommodated in a closed cavity;
• creating a vacuum in the cavity of the mold tool;
• encapsulating the semiconductor elements with a curable plastic in such a way that the curable plastic is directly adjacent to the laser facet;
• demolding the substrate with the light emitting elements embedded in plastic;
• and
• separating the components.