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US 2025/0062576 A1Published application
Edge mount memory connector footprint
AssigneeIntel Corporation
InventorLandon HANKS
Life of this patent
Estimating the term…
Abstract
A dual inline memory module (DIMM) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. The shape and placement of ground pads and signal pads can improve grounding of noise signals and improve the signal isolation on the signal pins. The ground pads can have additional ground vias to increase the ground path to the ground plane.
Claims20
A connector comprising:
- a housing;
- multiple ground pins to couple first ground pads on a dual inline memory module (DIMM) board to second grounds pads on a system board;
- and
- multiple signal pins to couple first signal pads on the DIMM board to second signal pads on the system board, where the signal pins are separated by ground pins;
- wherein the signal pins have a pin foot having a circular end tab to connect to respective second signal pads on the system board.
2 more elements
A computer system comprising:
- a motherboard including a first surface with first ground pads to couple to second ground pads of a dual inline memory module (DIMM) board and first signal pads to couple to second signal pads of the DIMM board, wherein the first signal pads have a circular shape;
- and
- a connector including:
- a housing;
- ground pins to couple the first ground pads to the second grounds pads;
- and
- signal pins to couple the first signal pads to the second signal pads;
- wherein the signal pins have a pin foot with the circular shape to connect to respective first signal pads having the circular shape.
5 more elements
Dependencies are inferred from the claim text.