Antenna apparatus employing radiation shield for integrated circuits

A method of forming an antenna apparatus, comprising:

• forming an antenna substrate comprising a first dielectric layer having opposite first and second surfaces, and a first metallization layer adjacent the second surface to form a ground plane for at least one antenna element, the first metallization layer being formed with a first opening;
• attaching the at least one antenna element to the first surface of the antenna substrate;
• forming a base substrate comprising:
• at least one second dielectric layer having opposite third and fourth surfaces;
• at least one via extending through the second dielectric layer, and a second metallization layer adjacent the third surface to form at least part of a radiation shield in conjunction with the first metallization layer, the second metallization layer having a second opening aligned with the first opening;
• and at least one signal via having a first end within the second opening and extending through the second dielectric layer;
• attaching the antenna substrate to the base substrate by at least connecting a coupling element within the first and second openings between the signal via and the antenna substrate, and attaching the first metallization layer to the second metallization layer;
• and
• attaching at least one radio frequency integrated circuit (RFIC), to the fourth surface of the base substrate, electrically connected to the at least one signal via,
• wherein said attaching the first metallization layer to the second metallization layer is performed by adhering the first metallization layer to the second metallization layer with a conductive adherent fill material layer.