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US 2025/0062306 A1Published application
Copper-bonded memory stacks with copper-bonded interconnection memory systems
AssigneeAvago Technologies International Sales Pte. Limited
InventorThomas Edward Dungan
Life of this patent
Estimating the term…
Abstract
A memory system includes a memory stack including a number of memory dies interconnected via copper bonding, a logic die coupled to the memory stack via a copper bonding. The memory system further includes a buffer die extended to provide the copper bonding between the logic die and the memory stack and a silicon carrier layer bonded to the memory stack and the logic die.
Claims20
A system comprising:
- a memory stack of memory dies;
- a logic die;
- a support die located at a depth on the logic die;
- a buffer die located at a bottom of the memory dies, extended toward the support die and overlapping the logic die, wherein the buffer die is connected to the logic die via copper bonding;
- wherein the buffer die provides coupling between the logic die and the memory stack through copper bonding to allow data signals to pass through the copper bonding.
2 more elements
A system comprising:
- a stack of memory dies;
- a support die located at a depth on a logic die, the logic die comprising data processing circuitry;
- a buffer die located between a top and a bottom of the memory dies, and extended toward the support die and overlapping the logic die, wherein the buffer die is connected to the logic die via copper bonding;
- wherein the buffer die provides coupling between the logic die and the stack through copper bonding to allow data signals of the data processing circuitry to pass through the copper bonding.
1 more element
A system comprising:
- a memory stack of memory dies interconnected via copper bonding;
- a logic die comprising data processing circuitry;
- a passive bridge die provides an interconnection between the memory stack and the logic die;
- wherein the passive bridge provides coupling between the logic die and the memory stack through copper bonding to allow data signals of the data processing circuitry to pass through the copper bonding.
1 more element
Dependencies are inferred from the claim text.