Semiconductor package and method of manufacturing the same

A semiconductor package comprising:

• a package substrate;
• a semiconductor chip disposed on an upper surface of the package substrate;
• a plurality of electronic integrated circuit chips arranged on the package substrate and spaced apart from the semiconductor chip in a horizontal direction;
• a photonic integrated circuit chip overlapping the plurality of electronic integrated circuit chips in a vertical direction, wherein a horizontal surface area of the photonic integrated circuit chip is greater than a horizontal surface area of each of the plurality of electronic integrated circuit chips, and a portion of photonic integrated circuit chip protrudes horizontally from the plurality of electronic integrated circuit chips beyond an outer edge of the package substrate;
• a reflective portion disposed on a lower surface of the portion of photonic integrated circuit chip and spaced apart from the plurality of electronic integrated circuit chips in the horizontal direction;
• and
• an optical fiber connected to the reflective portion and spaced apart from the photonic integrated circuit chip in the vertical direction,
• wherein the plurality of electronic integrated circuit chips are electrically connected to the photonic integrated circuit chip.

A semiconductor package comprising:

• a package substrate;
• a semiconductor chip disposed on an upper surface of the package substrate;
• a plurality of electronic integrated circuit chips arranged on the package substrate, spaced apart from the semiconductor chip in a horizontal direction, and electrically connected to the semiconductor chip through the package substrate;
• a photonic integrated circuit chip overlapping the plurality of electronic integrated circuit chips in a vertical direction, the photonic integrated circuit chip including an opto-electrical conversion unit and have a horizontal surface area that is greater than a horizontal surface area of each of the plurality of electronic integrated circuit chips, wherein a portion of the photonic integrated circuit chip protrudes from the plurality of electronic integrated circuit chips beyond an outer edge of the package substrate;
• a reflective portion disposed on a lower surface of portion the photonic integrated circuit chip protruding beyond the outer edge of the package substrate, the reflective portion including a groove spacer including a groove, a transparent spacer, and a plurality of mirrors;
• and
• an optical fiber connected to the groove of the groove spacer of the reflective portion and spaced apart from the photonic integrated circuit chip in the vertical direction,
• wherein the plurality of electronic integrated circuit chips are electrically connected to the photonic integrated circuit chip through through-vias located in the plurality of electronic integrated circuit chips.