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US 2025/0062299 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorMeng-Jie LEE
Life of this patent
Estimating the term…
Abstract
An electronic package and a manufacturing method thereof are provided, in which an electronic module including a bridging component and an electronic component is partially arranged on a carrying structure and partially protrudes outside the carrying structure, and a photonic component is electrically connected to the protruding part of the electronic module. With this configuration, the layout area of the carrying structure can be reduced to meet the requirement of miniaturization.
Claims22
An electronic package, comprising:
- a carrying structure;
- an electronic module defined with a first connection area and a second connection area separated from each other, wherein the electronic module is connected to the carrying structure via the first connection area, and the second connection area protrudes from the carrying structure;
- and
- a photonic component connected to the second connection area of the electronic module, wherein the photonic component and the carrying structure have a gap therebetween.
1 more element
A method of manufacturing an electronic package, comprising:
- providing an electronic module defined with a first connection area and a second connection area separated from each other;
- electrically connecting a photonic component to the second connection area of the electronic module;
- and
- connecting the first connection area of the electronic module onto a carrying structure, wherein the second connection area protrudes from the carrying structure, and the photonic component and the carrying structure have a gap therebetween.
1 more element
Dependencies are inferred from the claim text.