Package structure and method for forming same

A method for forming a package structure, comprising:

• providing a metal foil, wherein the metal foil comprises a first surface and a second surface that are opposite;
• forming a plurality of first surface metal bumps and first interconnect metal traces on the first surface of the metal foil;
• mounting a plurality of passive devices on top surfaces of the plurality of first surface metal bumps, wherein the plurality of passive devices are correspondingly electrically connected to the plurality of first surface metal bumps and the first interconnect metal traces;
• forming a first molding layer, wherein the first molding layer encapsulates the plurality of passive devices, the plurality of first surface metal bumps, and the first interconnect metal traces, and covers the first surface of the metal foil;
• etching the metal foil from the second surface of the metal foil to form a plurality of second interconnect metal traces and bonding pads that are correspondingly electrically connected to the plurality of first surface metal bumps and the first interconnect metal traces;
• forming a dielectric layer covering the plurality of second interconnect metal traces and a bottom surface of the first molding layer, wherein openings exposing surfaces of the bonding pads are defined in the dielectric layer;
• providing a first chip, wherein the first chip comprises a back face and a functional face that are opposite, second bonding pads being arranged on the functional face;
• mounting the back face of the first chip on a surface of the dielectric layer;
• and
• forming metal wires electrically connecting the second bonding pads to the bonding pads.