Stacked integrated circuit devices

A method comprising:

• electrically connecting a first die face-to-face with a second die using first die-interconnect contacts disposed on a first face of the first die and second die-interconnect contacts disposed on a second face of the second die, wherein a face of a die corresponds to a surface of the die bounding an active region of the die, and wherein the active region includes circuitry;
• forming a set of redistribution layers electrically connected to redistribution contacts on the first face, the second face, or both;
• and
• forming interconnect conductors external to the first die and external to the second die and electrically connected to the redistribution layers to provide signal paths from the first die, the second die, or both, to a set of external contacts.

A device comprising:

• a substrate having a set of external contacts on a second side;
• and
• a stacked integrated circuit (IC) device on a first side of the substrate, the stacked IC device comprising:
• a first die having a first face, a first active region adjacent to the first face, first circuitry disposed in the first active region, and first die-interconnect contacts disposed on the first face and electrically connected to the first circuitry;
• a second die having a second face, a second active region adjacent to the second face, second circuitry disposed in the second active region, and second die-interconnect contacts disposed on the second face and electrically connected to the second circuitry, wherein the first face is oriented toward the second face, and wherein the first die-interconnect contacts are electrically connected to the second die-interconnect contacts;
• a set of redistribution layers electrically connected to redistribution contacts on the first face, the second face, or both;
• and
• interconnect conductors external to the first die and external to the second die and electrically connected to the redistribution layers to provide signal paths from the first die, the second die, or both, to the set of external contacts.