Thin wafer, method of manufacturing the thin wafer, stack type semiconductor device including the thin wafer and method of manufacturing the stack type semiconductor device

Abstract

In an embodiment, a wafer may include a substrate including a first surface and a second surface opposite to each other, a polishing stop layer formed in a selected portion of the substrate, the polishing stop layer including one or more insulation trenches each filled with an insulation material and having a depth corresponding to a thickness of the substrate, and a device layer supported by the substrate and structured to include a plurality of conductive patterns configured to electrically connect different circuit elements in the substrate.

Dependencies are inferred from the claim text.