Semiconductor package and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSunggu KANG, Jae Choon KIM, Sung-Ho MUN, Hwanjoo PARK
Life of this patent
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Abstract
Disclosed is a semiconductor package comprising an interposer, a first semiconductor die below the interposer, and a first dummy die, a second dummy die, and a second semiconductor die over the interposer. The first semiconductor die, the second semiconductor die, the first dummy die, and the second dummy die overlap the interposer. The first semiconductor die overlaps the second semiconductor die. The second semiconductor die is between the first dummy die and the second dummy die.
Claims21
A semiconductor package, comprising:
- an interposer;
- a first semiconductor die below the interposer;
- and
- a first dummy die, a second dummy die, and a second semiconductor die over the interposer,
- the first semiconductor die, the second semiconductor die, the first dummy die, and the second dummy die overlap the interposer,
- the first semiconductor die overlap the second semiconductor die, and
- the second semiconductor die between the first dummy die and the second dummy die.
A semiconductor package, comprising:
- an interposer;
- a first semiconductor die below the interposer;
- and
- a first dummy die, a second dummy die, and a second semiconductor die over the interposer,
- the second semiconductor die between the first dummy die and the second dummy die,
- a width of the interposer being greater than a sum of a width of the first dummy die, a width of the second dummy die, and a width of the second semiconductor die,
- the width of the interposer being greater than a width of the first semiconductor die.
A semiconductor package, comprising:
- a package substrate;
- a stiffener in contact with the package substrate;
- a first semiconductor die over the package substrate;
- an interposer over the first semiconductor die;
- a first dummy die, a second dummy die, a third dummy die, a fourth dummy die, and a plurality of second semiconductor dies over the interposer;
- a first molding layer surrounding the first semiconductor die;
- and
- a second molding layer surrounding the first to fourth dummy dies and the second semiconductor dies,
- the second semiconductor dies between the first and second dummy dies, and
- the first and second dummy dies and the second semiconductor dies between the third and fourth dummy dies.
-27. (canceled)
Dependencies are inferred from the claim text.