Method for dipping adhesive material
OwnerJung Ho Shin, Chan Mi Lee +8inventors
InventorsJung Ho Shin, Chan Mi Lee, Ji Ho Joo, Gwang Mun Choi, Yong Sung Eom, Kwang Seong Choi, Seok Hwan Moon, Jin Hyuk Oh, Ho Gyeong Yun, Ki Seok Jang
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Abstract
The present invention relates to a method for dipping an adhesive material, and the method for dipping an adhesive material includes dipping an adhesive material onto a first dipping stamp, transferring the adhesive material, which is dipped onto the first dipping stamp, to a target substrate, and transferring a device to the target substrate, to which the adhesive material is transferred.
Claims20
A method for dipping an adhesive material, the method comprising:
- dipping an adhesive material onto a first dipping stamp;
- transferring the adhesive material, which is dipped onto the first dipping stamp, to a target substrate;
- and
- transferring a device to the target substrate, to which the adhesive material is transferred.
A method for dipping an adhesive material, the method comprising:
- dipping an adhesive material onto a second dipping stamp having one or more devices provided thereon;
- and
- transferring and bonding the one or more devices to a target substrate through the adhesive material dipped onto the second dipping stamp.
Dependencies are inferred from the claim text.