Injection molded solder head with improved sealing performance
AssigneeInternational Business Machines Corporation
InventorsSayuri Hada, Toyohiro Aoki, Takashi Hisada, Shintaro Yamamichi
Life of this patent
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Abstract
An apparatus for injecting solder material in via holes located in a top surface of a wafer is provided. The apparatus includes an injection head having a contact surface for contacting the top surface of the wafer, and at least one aperture for injecting the solder material though the injection head into the via holes. The apparatus further includes an evacuating device connected to the injection head for evacuating gas from the via holes. The injection head has a chamfer part on an edge of a contact surface contacting the top surface of the wafer.
Claims10
A method for injecting solder material in via holes located in a top surface of a wafer, the method comprising:
- evacuating, by an evacuating device, gas from via holes;
- injecting the solder material into the via holes, by an injection head connected to the evacuating device and having a contact surface for contacting the top surface of the wafer, and at least one aperture for solder injection to form a solder bump;
- and
- moving the injection head so as to move a chamfer part of an edge of the injection head over the solder bump to scrape the solder bump to an intended height.
A method for injecting solder material in via holes located in a top surface of a wafer, the method comprising:
- evacuating, by an evacuating device, gas from via holes;
- injecting the solder material into the via holes, by an injection head connected to the evacuating device and having a contact surface for contacting the top surface of the wafer, and a plurality of aperture for solder injection to form one or more solder bumps;
- and
- moving the injection head so as to move a chamfer part of an edge of the injection head over the one or more solder bumps to scrape the one or more solder bumps to an intended height.
Dependencies are inferred from the claim text.