Bonding apparatus and method of manufacturing an integrated circuit package using the apparatus
OwnerJen-Hao Liu, Amram Eitan +3inventors
InventorsJen-Hao Liu, Amram Eitan, Chih-Yuan Chiu, Chi-Chun Peng, Yu-Hong Du
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Abstract
A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.
Claims20
A bonding apparatus, comprising:
- a vacuum pump;
- a blower;
- a controller communicatively coupled to the vacuum pump and the blower;
- and
- a bonding head, wherein the bonding head comprises:
- a main body;
- a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump;
- and
- a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.
A bonding apparatus, comprising:
- a controller;
- a vacuum pump, a first vacuum valve, and a second vacuum valve communicatively coupled to the controller;
- a blower and a gas valve communicatively coupled to the controller;
- and
- a bonding head, wherein the bonding head comprises:
- a main body;
- a protrusion on a central portion of a bottom surface of the main body;
- a first plurality of vacuum channels in the main body, wherein the first plurality of vacuum channels are connected to the vacuum pump through the first vacuum valve, and wherein the controller is configured to create vacuum in the first plurality of vacuum channels simultaneously;
- and
- a first plurality of switchable channels in the main body, wherein the first plurality of switchable channels are connected to the vacuum pump through the second vacuum valve and to the blower through the gas valve, wherein the controller is configured to create vacuum in the first plurality of switchable channels simultaneously or create blowing in the first plurality of switchable channels simultaneously.
A method for forming an integrated circuit package, the method comprising:
- attaching a first substrate to a bonding head by creating negative pressure in a first vacuum channel and a first switchable channel in the bonding head, wherein the first switchable channel is between a first sidewall of the bonding head and the first vacuum channel;
- placing the first substrate to a top surface of a second substrate and forming bonding between the first substrate and the second substrate;
- releasing the negative pressure in the first vacuum channel while maintaining the negative pressure in the first switchable channel;
- and
- after releasing the negative pressure in the first vacuum channel, releasing the negative pressure in the first switchable channel and blowing the first substrate away from the bonding head by creating positive pressure in the first switchable channel.
Dependencies are inferred from the claim text.