Semiconductor package

A semiconductor package comprising:

• a redistribution insulation layer;
• a connection structure disposed on the redistribution insulation layer in a first direction and comprising a base layer, a metal pattern, and a cavity;
• a semiconductor chip disposed on the redistribution insulation layer in the first direction, the semiconductor chip spaced apart from the connection structure;
• and
• a molding layer disposed between the connection structure and the semiconductor chip, wherein the semiconductor chip and the molding layer are disposed in the cavity;
• wherein the metal pattern is disposed on the redistribution insulation layer in the first direction and at least partially between the base layer and the molding layer, the metal pattern comprising:
• a first metal pattern extending, in a second direction crossing the first direction, from an inner surface of the connection structure into the base layer and separating at least a portion of the base layer from at least a portion of the redistribution insulation layer;
• a second metal pattern disposed on an inner surface of the first metal pattern and extending in the first direction;
• and
• a third metal pattern disposed on a top surface in the first direction of the second metal pattern and extending, in the second direction, from an inner surface of the second metal pattern toward the connection structure.

A semiconductor package comprising:

• a first redistribution structure comprising a plurality of first redistribution line patterns and a first redistribution insulation layer at least partially surrounding the plurality of first redistribution line patterns;
• a connection structure disposed on the first redistribution structure in a first direction and comprising a metal pattern, a cavity, a plurality of connection pads, a plurality of connection vias, and a plurality of base layers at least partially surrounding the plurality of connection vias, wherein connection pads of the plurality of connection pads are disposed on different levels in the first direction from each other, and wherein the plurality of connection vias interconnect the plurality of connection pads;
• a semiconductor chip disposed on the first redistribution structure in the first direction;
• a molding layer disposed between the connection structure and the semiconductor chip and covering a top surface in the first direction of the connection structure and of the semiconductor chip, wherein the semiconductor chip and the molding layer are disposed in the cavity;
• and
• a second redistribution structure disposed on the semiconductor chip in the first direction and comprising a plurality of second redistribution line patterns and a second redistribution insulation layer at least partially surrounding the plurality of second redistribution line patterns,
• wherein the metal pattern is at least partially disposed between the plurality of base layers and the molding layer, the metal pattern comprising:
• a first metal pattern extending, in a second direction crossing the first direction, from an inner surface of the connection structure into the plurality of base layers and separating at least a portion of the plurality of base layers from at least a portion of the first redistribution structure;
• a second metal pattern disposed on an inner surface of the first metal pattern and extending in the first direction from a top surface in the first direction of the first redistribution structure to a top surface in the first direction of an uppermost base layer in the first direction of the plurality of base layers;
• and
• a third metal pattern disposed on a top surface in the first direction of the second metal pattern and of the uppermost base layer and extending, in the second direction, from an inner surface of the second metal pattern toward the plurality of base layers.