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US 2025/0062246 A1Published application
Structure for delamination mitigation in a semiconductor device
AssigneeQUALCOMM Incorporated
InventorsJoan Rey Villarba BUOT, Zhijie WANG, Hong Bok WE, Sang-Jae LEE
Life of this patent
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Abstract
Disclosed are devices in which a die, such as a system-on-chip (SoC) die is attached to an interposer with a mold. Unlike convention devices, the contact area for adhesion is increased by providing vertical surfaces in addition to lateral surfaces for attachment. In so doing, possibility of delamination is decreased significantly.
Claims24
A device, comprising:
- a die;
- an interposer above the die;
- and
- a mold in between the die and the interposer, the mold encapsulating upper and side surfaces of the die,
- wherein the interposer comprises:
- a first interposer solder resist (SR);
- a first interposer metal plane on the first interposer SR;
- a laminate core on the first interposer metal plane;
- a second interposer metal plane on the laminate core;
- a second first interposer SR on the second interposer metal plane;
- and
- one or more interposer vias formed in the laminate core, the one or more interposer vias electrically coupling the first and second interposer metal planes;
- wherein the device further comprises one or more adhesion holes exposing side surfaces of one or more SR posts and one or more post landings, the one or more SR posts being portions of the first interposer SR and the one or more post landings being portions of the first interposer metal plane, the one or more SR posts being formed on and in contact with corresponding one or more post landings, and
- wherein the mold fills the one or more adhesion holes such that the mold is in contact with the exposed side surfaces of one or more SR posts and of the one or more post landings.
11 more elements
A method of fabricating a device, the method comprising:
- providing a die;
- forming an interposer above the die;
- and
- forming a mold in between the die and the interposer, the mold encapsulating upper and side surfaces of the die,
- wherein the interposer comprises:
- a first interposer solder resist (SR);
- a first interposer metal plane on the first interposer SR;
- a laminate core on the first interposer metal plane;
- a second interposer metal plane on the laminate core;
- a second first interposer SR on the second interposer metal plane;
- and
- one or more interposer vias formed in the laminate core, the one or more interposer vias electrically coupling the first and second interposer metal planes;
- wherein the device further comprises one or more adhesion holes exposing side surfaces of one or more SR posts and one or more post landings, the one or more SR posts being portions of the first interposer SR and the one or more post landings being portions of the first interposer metal plane, the one or more SR posts being formed on and in contact with corresponding one or more post landings, and
- wherein the mold fills the one or more adhesion holes such that the mold is in contact with the exposed side surfaces of one or more SR posts and of the one or more post landings.
11 more elements
Dependencies are inferred from the claim text.