Semiconductor structure and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Meng-Liang Lin, Ying-Ju Chen, Shin-Puu Jeng
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Abstract
A semiconductor structure includes a circuit substrate, at least one semiconductor package, at least one semiconductor device, and a ring structure. The at least one semiconductor package is disposed on the circuit substrate, and the semiconductor package includes a plurality of integrated circuit structures. The at least one semiconductor device, disposed on the circuit substrate and aside the semiconductor package. The ring structure is disposed on the circuit board. The ring structure includes at least one opening pattern corresponding to the semiconductor device.
Claims20
A semiconductor structure, comprising:
- a circuit substrate;
- at least one semiconductor package, disposed on the circuit substrate, wherein the semiconductor package comprises a plurality of integrated circuit structures;
- at least one semiconductor device, disposed on the circuit substrate and aside the semiconductor package;
- and
- a ring structure, disposed on the circuit board, wherein the ring structure comprises at least one opening pattern corresponding to the semiconductor device.
A semiconductor structure, comprising:
- a circuit substrate;
- a plurality of integrated circuit structures, laterally disposed on the circuit substrate;
- an encapsulating layer, laterally encapsulating the plurality of integrated circuit structures;
- at least one semiconductor device, disposed on the circuit substrate and separated from the encapsulating layer;
- and
- a ring structure, disposed on the circuit substrate, wherein the ring structure comprises a base portion and an overhang portion laterally extending across the at least one semiconductor device with respect to the base portion, wherein the overhang portion has at least two different thicknesses.
A method of forming a semiconductor structure, comprising:
- bonding at least one semiconductor package to a circuit board;
- bonding a plurality of semiconductor devices to the circuit substrate and around the semiconductor package;
- and
- mounting a ring structure on the circuit board, wherein the ring structure comprises a plurality of opening patterns corresponding to the plurality of semiconductor devices.
Dependencies are inferred from the claim text.