Semiconductor package and wiring substrate included in the same
AssigneeSamsung Electronics Co., Ltd.
InventorKANG JOON LEE
Life of this patent
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Abstract
A semiconductor package according to an embodiment includes a semiconductor chip, and a redistribution portion electrically connected to the semiconductor chip. The redistribution portion includes an inner insulation layer, an interconnection pad, and an outer insulation layer. The interconnection pad is on the inner insulation layer and includes a first region and a second region outside the first region and having an opening. The outer insulation layer includes a first portion on the second region of the interconnection pad and a second portion filling at least a part of the opening.
Claims20
A semiconductor package, comprising:
- a semiconductor chip;
- and
- a redistribution portion electrically connected to the semiconductor chip,
- wherein the redistribution portion includes:
- an inner insulation layer;
- an interconnection pad on the inner insulation layer, the interconnection pad including a first region and a second region outside the first region and having an opening;
- and
- an outer insulation layer including a first portion on the second region of the interconnection pad and a second portion filling at least a part of the opening.
A wiring substrate, comprising:
- an inner insulation layer;
- an interconnection pad on the inner insulation layer, the interconnection pad including a first region and a second region outside the first region and having an opening;
- and
- an outer insulation layer including a first portion on the second region of the interconnection pad and a second portion filling at least a part of the opening.
A semiconductor package, comprising:
- an insulation layer;
- an interconnection pad on the insulation layer;
- and
- a cover insulation layer on an edge region of the interconnection pad on the insulation layer, the cover insulation layer including a connection portion penetrating a part of the interconnection pad and connected to the insulation layer.
Dependencies are inferred from the claim text.