High-frequency high-power density module power supply, parallel combination, manufacturing method, and flexible and rigid combination assembly

A high-frequency high-power density module power supply, comprising:

• at least one power semiconductor assembly, wherein the power semiconductor assembly comprises a power semiconductor element and a first plastic package body, and the first plastic package body wraps the power semiconductor element;
• a carrier element arranged at the bottom of the high-frequency high-power density module power supply, wherein the power semiconductor assembly is arranged above the carrier element, and the carrier element is electrically connected with the power semiconductor assembly;
• a bottom pin, the bottom pin being arranged at the bottom of a high-frequency high-power density module power supply;
• an electrical connection assembly, the electrical connection assembly being used for electrically connecting the power semiconductor assembly to a bottom pin;
• the top of the power semiconductor assembly is provided with a top heat dissipation structure;
• the top heat dissipation structure comprises a top heat dissipation coating and a thermal connector, and the top heat dissipation coating is arranged on the upper surface of the first plastic packaging body through electroplating;
• the thermal connector is disposed inside the first plastic package body, and the thermal connector thermally connects the at least one power semiconductor element with the top heat dissipation plating layer.

A high-frequency high-power density module power supply, comprising:

• a bottom pin, the bottom pin being arranged at the bottom of a high-frequency high-power density module power supply;
• a carrier element, wherein at least one surface of the carrier element is provided with a surface power pin;
• the carrier element is arranged above the bottom pin;
• at least one rigid part, wherein the rigid part comprises at least one power semiconductor assembly, the rigid part is provided with at least one power pin, the rigid part is electrically connected with the surface power pin, and the rigid part is arranged on the side surface of the carrier element.