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US 2025/0062236 A1Published application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration
AssigneeApple Inc.
InventorsSanjay Dabral, Zhitao Cao, Kunzhong Hu
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Abstract
Structures and methods of forming fine die-to-die interconnect routing are described. In an embodiment, a package includes a package-level RDL than spans across a die set and includes a plurality of die-to-die interconnects connecting contact pads between each die. In an embodiment, the plurality of die-to-die interconnects is embedded within one or more photoimageable organic dielectric layers.
Claims15
A chip comprising:
- a semiconductor layer;
- a first die area in the semiconductor layer;
- a back end of the line (BEOL) build-up structure spanning over the first die area, the BEOL build-up structure including a first lower metallic seal around the first die area;
- a chip-level redistribution layer (RDL) over the BEOL build-up structure, the chip-level RDL including an upper metallic seal along a periphery of the chip.
1 more element
Dependencies are inferred from the claim text.